Citation link:
Authors:
Partinova, Simona Peneva; Партинова, Симона Пенева; Takov, Tihomir Borisov; Таков, Тихомир Борисов
Title:
Design and production of precise thick film circuits using photolithographic technology
Date of Issue:
2007
Is Part of:
Proceedings of the Technical University – Sofia, 57(2), 2007, pp. 254-259
Publisher:
TU – Sofia
Identifiers:
1311-0829 [issn]
Type:
Article
Language:
eng
Abstract:
Fodel® Photoprintable Thick Film Pastes made by DuPont guarantee that printed circuits made by using these pastes benefit from both the recognized reliability of ceramic materials and the higher image density that is common for the thin film circuits by increasing the density in the X-Y plane by 400-500% compared to the conventional screen printing process. This is achieved without a reduction of technological tolerances by improving lines and spaces resolution and by reducing the size of vias. In this paper we are going to review the design and fabrication of a multichip module (MCM) by using photolithographic methods to create thick film layers in hybrid circuits.
Description:
Reviewer prof. Marin Hristov. - Incl. figures. - References, pp. 259
