Citation link:
Authors:
Йорданов, Никола; Yordanov, Nikola; Филипов, Филип; Philippov, Philip; Видеков, Валентин Христов; Videkov, Valentin Hristov; Арнаудов, Радосвет; Arnaudov, Radosvet
Title:
Електрохимично израстване на топологично структурирани дебели слоеве
Other Titles:
Electrochemical plating of topologically structured thick layers
Date of Issue:
2007
Is Part of:
Proceedings of the Technical University – Sofia, 57(1), 2007, pp. 55-60
Publisher:
TU – Sofia
Identifiers:
1311-0829 [issn]
Type:
Article
Language:
bul
Abstract:
In the present report some basic methods in the electrochemical plating of copper or some other metal layers, at structured topology layout, are revealed. The given arbitrary topology layout could be structured by means of additive or subtractive methods. Technology routes for electrochemical growth of metal structures, as well as their capabilities and restrictions are commented. The achieved results in application of these methods during the last 1015 years at the department KTPPME are considered.
Description:
Рец. доц. Стоян Гишин. - Съдържа фигури и схеми. – Библиогр., с. 60.
