Yordanov, Nikola Stefanov; Andreev, Svetozar Krastev; Ivanova, Filipina; Arnaudov, Radosvet Georgiev
Electrochemical formation of three-dimensional golden microcontacts
Proceedings of the Technical University – Sofia, 56(1), 2006, pp. 92-96
TU - Sofia
electroplating; bumps; flip-chip; gold
Electroplating of golden layers is often used in the microelectronic devices. This paper reports our experimental results from formation of golden micro - contact elements – bumps with diameter 300µm, developed by UV-LIGA process. The gold-acid-cyanide electrolyte, which is used, has no influence on the dry negative photo-resist (PR). We investigate different electroplating regimes – direct current and impulse-current regimes, the uniformity of micro - contact elements (MCE) growth over the matrix surface and the kind of bumps’ surface.
Reviewer prof. Tihomir Takov. - Formulas, diagr. - References, pp. 96